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Product Name: BGA paste Model: NC-559-UV One. Assistant U.S. AMTECH paste (NC-559 and RMA-223) Products:Two U.S. AMTECH developed for use in mobile phone PCB, BGA, and PGA of SMD rework and other help paste, which uses the low ionic activator system, run fast tin, smoke the low level of surface residue after curing insulation resistance value is high, therefore, mobile phones and other electrical interference with communications products is very small. Product Features: 1.RMA-223 to help moderate activity of rosin paste, widely used in mobile phone board of SMD rework process. 2.NC-559 for the disposable type to help paste the residue color is very light, very high values of SIR, recommended for BGA, CSP, etc. make up the ball and the ball array solder joint repair. Packing: 100 g / bottle, and 10ml / support

ATI Heat Direct Stencil special for ATI chips 41pcs

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Hot air blower + electric solder 2 in 1 cocok untuk services NB dan HP

CCD CAMERA FOR BGA REWORK STATION WIHT MANUAL ZOOM OPTICAL CCD supervising system for BGA rework With a tele-camera and AV cable sangat membatu dalam proces reballing

Electric soldering terperature can setting manual bit can change model knif, original and blinde easy to use

Capton Tape / Isolasi Tahan Panas: Untuk process Reball, Reflow, agar komponen lain tidak over heat, dan meleleh mudah pengunaanya, bisa di pakai 1 s/d 3x

Kapton Tape / Isolasi Tahan Panas: Untuk process Reball, Reflow, agar komponen lain tidak over heat, dan meleleh mudah pengunaanya, bisa di pakai 1 s/d 3x